EUREKA DRY TECH TD-2003 FAST SUPER DRYER

Dehumidifier Core Unit Adsorption Stage:

During the adsorption stage, the dehumidifier core unit's valve doors open on the inside and seals from the outside. This allows moisture inside the dry cabinet to be naturally adsorbed into the multi-porous molecular sieves in the core unit. During this stage, the core unit performs its desiccating function without any power consumption and will continue to desiccate even when power supply is interrupted. Operational light indicators inside the cabinet will remain off during this time.

Dehumidifier Core Unit Exhaust Stage:  

The core unit valve doors automatically seals inside the dry cabinet and open vents outwards to exhaust & expel the moisture absorbed from inside the Dry Box. During this stage, operational indicators will be on.

Moisture adsorbed by the multi-porous molecular sieves is expelled by the drying unit and the core unit is automatically regenerated for moisture adsorption.

There are no water tanks to empty, desiccant bags & packs to replace, or any other maintenance required by the user. Simply plug in the power cord, set the desired RH level and the Eureka Auto Dry Box will begin its dehumidifying operation cycle. The core unit performs the moisture adsorption process without any power required. Thus is safe and clean for the environment.

Why do you need a Eureka Dry Tech Fast Super Dryer?

As development cycles shorten, invention of ever-smaller device, innovative use of new materials and larger wafer chip development, all contributing to a rapid increase of moisture-sensitive devices and higher levels of trace moisture sensitivity during reflow process. Internal component damage due to trace moisture expansion,  will result in MSDs during surface mount reflow process. Storing moisture sensitive devices (MSD) and components in Eureka Dry Tech's Fast Super Dryer JEDEC Dry Cabinet will provide extended floor life and will prevent moisture expansion, popcorning, intermetallic growth, oxidation, solderability and other moisture related problem from occurring in the first place.

How does trace moisture affect SMT production?

• Trace moisture causes failures to components and PCBs during high temperature reflow process. When absorbed moisture rapidly expand from high temperatures, common internal component damages and failures such as micro-cracking, blistering, popcorn effects will occur in moisture sensitive devices, packages and components. 

• Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB when moisture inside the layers causes expansion during the reflow process.